System and method for authenticating components

ABSTRACT

A system and method for authenticating an additively manufactured component are provided. The method includes locating an identifying region on the component which may be positioned at a predetermined location relative to an identifiable datum feature. The identifying region may be scanned to determine a component identifier of the component. A reference identifier may be obtained from a database and compared to the component identifier to determine whether the component is authentic.

FIELD

The present subject matter relates generally to additively manufacturedcomponents, and more particularly, to systems and methods forauthenticating additively manufactured components including features forimproved part identification or counterfeit prevention.

BACKGROUND

Original equipment manufacturers (OEMs) in a variety of industries havean interest in ensuring that replacement components used with theirproducts or equipment are manufactured according to standards set andcontrolled by the OEM. Using the aviation industry as an example, themanufacturer of a gas turbine engine, as well as the airlines and thepassengers that rely on them, can be exposed to serious risks ifcounterfeit or replica replacement parts are readily available for andinstalled on these engines.

For example, such counterfeit components can pose a severe risk to theintegrity of the gas turbine engines or may otherwise result in avariety of problems for the OEM and the end user. More specifically, OEMcomponents may require rigorous attention to detail to ensure soundmaterial properties and capabilities for the specific application aswell as sophisticated inspections to verify the component performance.OEMs cannot ensure the integrity or compatibility of counterfeit parts,which may result in dangerous engine operation and increase the risk ofpotential failure.

In addition, counterfeit parts compromise the OEMs ability to controlthe quality associated with their products. For example, inexpensivereplicas and inferior components on the market are a real threat, bothto the engines on which they are installed and to the reputation of theOEM. Moreover, failure of a gas turbine engine due to a counterfeitreplacement component might subject the OEM to misdirected legalliability and OEMs may lose a significant revenue stream by not beingable to control the sale of OEM replacement components.

Additive manufacturing technologies are maturing at a fast pace. Forexample, very accurate additive manufacturing printers using a varietyof materials, such as metals and polymers, are becoming available atdecreasing costs. In addition, improved scanning technologies andmodeling tools are now available. As a result, certain OEMs arebeginning to use such technologies to produce original and replacementparts. However, the advance of additive manufacturing technologies alsoresults in a lower barrier to entry into the additive manufacturingspace. Therefore, replacement components may be more easily reverseengineered and copied, and there is an increased risk of third partiesmanufacturing and installing counterfeit components on OEM equipment,such as a gas turbine engine, resulting in the dangers described brieflyabove.

There is thus a need for a technology that allows genuine parts to bedistinguished from counterfeits to ensure that parts created throughadditive manufacturing cannot be duplicated by an unauthorized thirdparty and passed off as genuine OEM parts. Accordingly, systems andmethods for authenticating additively manufactured components todistinguish genuine parts from counterfeit parts would be useful.

BRIEF DESCRIPTION

Aspects and advantages of the invention will be set forth in part in thefollowing description, or may be obvious from the description, or may belearned through practice of the invention.

In one exemplary embodiment of the present disclosure, a method ofauthenticating an additively manufactured component is provided. Themethod includes obtaining, by one or more processors, data indicative ofan identifying region on the component, the identifying regioncontaining a component identifier of the component. The method furtherincludes obtaining, by one or more processors, data indicative of thecomponent identifier by interrogating the identifying region of thecomponent with a scanner. In addition, the method includes determining,by one or more processors, that the component is authentic based on thedata acquired by the scanner.

In another exemplary aspect of the present disclosure, a system forauthenticating an additively manufactured component is provided. Thesystem includes one or more processors and one or more memory devices,the one or more memory devices storing computer-readable instructionsthat when executed by the one or more processors cause the one or moreprocessors to perform operations. The operations include obtaining dataindicative of an identifying region on the component, the identifyingregion containing a component identifier of the component anddetermining the component identifier by interrogating the identifyingregion of the component using a scanner. The operations further includeobtaining a reference identifier from a database and determining thatthe component is authentic if the component identifier matches thereference identifier.

In still another exemplary aspect of the present disclosure, a method ofadditively manufacturing a component is provided. The method includesadditively manufacturing the component including a surface andspecifying an identifying region on the surface of the component. Themethod further includes obtaining data indicative of a componentidentifier of the component by interrogating the identifying region ofthe component using a scanner and storing the component identifier in adatabase as a reference identifier.

These and other features, aspects and advantages of the presentinvention will become better understood with reference to the followingdescription and appended claims. The accompanying drawings, which areincorporated in and constitute a part of this specification, illustrateembodiments of the invention and, together with the description, serveto explain the principles of the invention.

BRIEF DESCRIPTION OF THE DRAWINGS

A full and enabling disclosure of the present invention, including thebest mode thereof, directed to one of ordinary skill in the art, is setforth in the specification, which makes reference to the appendedfigures.

FIG. 1 provides a perspective view of an additively manufacturedcomponent according to an exemplary embodiment of the present subjectmatter.

FIG. 2 provides a cross sectional view of the exemplary component ofFIG. 1, taken along Line 2-2 of FIG. 1.

FIG. 3 is a plot illustrating the variation of a surface height of theexemplary component of FIG. 1 about a circumferential directionaccording to an exemplary embodiment of the present subject matter.

FIG. 4 is a method for additively manufacturing a component according toan exemplary embodiment of the present subject matter.

FIG. 5 is a method for authenticating a component according to anexemplary embodiment of the present subject matter.

FIG. 6 depicts certain components of an authentication system accordingto example embodiments of the present subject matter.

Repeat use of reference characters in the present specification anddrawings is intended to represent the same or analogous features orelements of the present invention.

DETAILED DESCRIPTION

Reference will now be made in detail to present embodiments of theinvention, one or more examples of which are illustrated in theaccompanying drawings. The detailed description uses numerical andletter designations to refer to features in the drawings. Like orsimilar designations in the drawings and description have been used torefer to like or similar parts of the invention.

The present disclosure is generally directed to a system and method forauthenticating an additively manufactured component. The method includeslocating an identifying region on the component which may be positionedat a predetermined location relative to an identifiable datum feature.The identifying region may be scanned to determine a componentidentifier of the component. A reference identifier may be obtained froma database and compared to the component identifier to determine whetherthe component is authentic.

In general, the components described herein may be manufactured orformed using any suitable process. However, in accordance with severalaspects of the present subject matter, these components may be formedusing an additive-manufacturing process, such as a 3-D printing process.The use of such a process may allow the components to be formedintegrally, as a single monolithic component, or as any suitable numberof sub-components. In particular, the manufacturing process may allowthese components to be integrally formed and include a variety offeatures not possible when using prior manufacturing methods. Forexample, the additive manufacturing methods described herein enable themanufacture of components having various features, configurations,thicknesses, materials, densities, and identifying features not possibleusing prior manufacturing methods. Some of these novel features aredescribed herein.

As used herein, the terms “additively manufactured” or “additivemanufacturing techniques or processes” refer generally to manufacturingprocesses wherein successive layers of material(s) are provided on eachother to “build-up,” layer-by-layer, a three-dimensional component. Thesuccessive layers generally fuse together to form a monolithic componentwhich may have a variety of integral sub-components. Although additivemanufacturing technology is described herein as enabling fabrication ofcomplex objects by building objects point-by-point, layer-by-layer,typically in a vertical direction, other methods of fabrication arepossible and within the scope of the present subject matter. Forexample, although the discussion herein refers to the addition ofmaterial to form successive layers, one skilled in the art willappreciate that the methods and structures disclosed herein may bepracticed with any additive manufacturing technique or manufacturingtechnology. For example, embodiments of the present invention may uselayer-additive processes, layer-subtractive processes, or hybridprocesses.

Suitable additive manufacturing techniques in accordance with thepresent disclosure include, for example, Fused Deposition Modeling(FDM), Selective Laser Sintering (SLS), 3D printing such as by inkjetsand laserjets, Sterolithography (SLA), Direct Selective Laser Sintering(DSLS), Electron Beam Sintering (EBS), Electron Beam Melting (EBM),Laser Engineered Net Shaping (LENS), Laser Net Shape Manufacturing(LNSM), Direct Metal Deposition (DMD), Digital Light Processing (DLP),Direct Selective Laser Melting (DSLM), Selective Laser Melting (SLM),Direct Metal Laser Melting (DMLM), and other known processes.

The additive manufacturing processes described herein may be used forforming components using any suitable material. For example, thematerial may be plastic, metal, concrete, ceramic, polymer, epoxy,photopolymer resin, or any other suitable material that may be in solid,liquid, powder, sheet material, wire, or any other suitable form. Morespecifically, according to exemplary embodiments of the present subjectmatter, the additively manufactured components described herein may beformed in part, in whole, or in some combination of materials includingbut not limited to pure metals, nickel alloys, chrome alloys, titanium,titanium alloys, magnesium, magnesium alloys, aluminum, aluminum alloys,and nickel or cobalt based superalloys (e.g., those available under thename Inconel® available from Special Metals Corporation). Thesematerials are examples of materials suitable for use in the additivemanufacturing processes described herein, and may be generally referredto as “additive materials.”

In addition, one skilled in the art will appreciate that a variety ofmaterials and methods for bonding those materials may be used and arecontemplated as within the scope of the present disclosure. As usedherein, references to “fusing” may refer to any suitable process forcreating a bonded layer of any of the above materials. For example, ifan object is made from polymer, fusing may refer to creating a thermosetbond between polymer materials. If the object is epoxy, the bond may beformed by a crosslinking process. If the material is ceramic, the bondmay be formed by a sintering process. If the material is powdered metal,the bond may be formed by a melting or sintering process. One skilled inthe art will appreciate that other methods of fusing materials to make acomponent by additive manufacturing are possible, and the presentlydisclosed subject matter may be practiced with those methods.

In addition, the additive manufacturing process disclosed herein allowsa single component to be formed from multiple materials. Thus, thecomponents described herein may be formed from any suitable mixtures ofthe above materials. For example, a component may include multiplelayers, segments, or parts that are formed using different materials,processes, and/or on different additive manufacturing machines. In thismanner, components may be constructed which have different materials andmaterial properties for meeting the demands of any particularapplication. In addition, although the components described herein areconstructed entirely by additive manufacturing processes, it should beappreciated that in alternate embodiments, all or a portion of thesecomponents may be formed via casting, machining, and/or any othersuitable manufacturing process. Indeed, any suitable combination ofmaterials and manufacturing methods may be used to form thesecomponents.

An exemplary additive manufacturing process will now be described.Additive manufacturing processes fabricate components usingthree-dimensional (3D) information, for example a three-dimensionalcomputer model, of the component. Accordingly, a three-dimensionaldesign model of the component may be defined prior to manufacturing. Inthis regard, a model or prototype of the component may be scanned todetermine the three-dimensional information of the component. As anotherexample, a model of the component may be constructed using a suitablecomputer aided design (CAD) program to define the three-dimensionaldesign model of the component.

The design model may include 3D numeric coordinates of the entireconfiguration of the component including both external and internalsurfaces of the component. For example, the design model may define thebody, the surface, and/or any surface features such as irregularities,component identifiers, or datum features, as well as internalpassageways, openings, support structures, etc. In one exemplaryembodiment, the three-dimensional design model is converted into aplurality of slices or segments, e.g., along a central (e.g., vertical)axis of the component or any other suitable axis. Each slice may definea thin cross section of the component for a predetermined height of theslice. The plurality of successive cross-sectional slices together formthe 3D component. The component is then “built-up” slice-by-slice, orlayer-by-layer, until finished.

In this manner, the components described herein may be fabricated usingthe additive process, or more specifically each layer is successivelyformed, e.g., by fusing or polymerizing a plastic using laser energy orheat or by sintering or melting metal powder. For example, a particulartype of additive manufacturing process may use an energy beam, forexample, an electron beam or electromagnetic radiation such as a laserbeam, to sinter or melt a powder material. Any suitable laser and laserparameters may be used, including considerations with respect to power,laser beam spot size, and scanning velocity. The build material may beformed by any suitable powder or material selected for enhancedstrength, durability, and useful life, particularly at hightemperatures.

Each successive layer may be, for example, between about 10 μm and 200μm, although the thickness may be selected based on any number ofparameters and may be any suitable size according to alternativeembodiments. Therefore, utilizing the additive formation methodsdescribed above, the components described herein may have cross sectionsas thin as one thickness of an associated powder layer, e.g., 10 μm,utilized during the additive formation process.

In addition, utilizing an additive process, the surface finish andfeatures of the components may vary as need depending on theapplication. For example, the surface finish may be adjusted (e.g., madesmoother or rougher) by selecting appropriate laser scan parameters(e.g., laser power, scan speed, laser focal spot size, overlap betweenpasses, etc.) during the additive process, especially in the peripheryof a cross-sectional layer which corresponds to the part surface. Forexample, a rougher finish may be achieved by increasing laser scan speedor decreasing the size of the melt pool formed, and a smoother finishmay be achieved by decreasing laser scan speed or increasing the size ofthe melt pool formed. The scanning pattern and/or laser power can alsobe changed to change the surface finish in a selected area.

Notably, in exemplary embodiments, several features of the componentsdescribed herein were previously not possible due to manufacturingrestraints. However, the present inventors have advantageously utilizedcurrent advances in additive manufacturing techniques to developexemplary embodiments of such components generally in accordance withthe present disclosure. While the present disclosure is not limited tothe use of additive manufacturing to form these components generally,additive manufacturing does provide a variety of manufacturingadvantages, including ease of manufacturing, reduced cost, greateraccuracy, etc.

In this regard, utilizing additive manufacturing methods, evenmulti-part components may be formed as a single piece of continuousmetal, and may thus include fewer sub-components and/or joints comparedto prior designs. The integral formation of these multi-part componentsthrough additive manufacturing may advantageously improve the overallassembly process. For example, the integral formation reduces the numberof separate parts that must be assembled, thus reducing associated timeand overall assembly costs. Additionally, existing issues with, forexample, leakage, joint quality between separate parts, and overallperformance may advantageously be reduced.

Also, the additive manufacturing methods described above enable muchmore complex and intricate shapes and contours of the componentsdescribed herein. For example, such components may include thinadditively manufactured layers and novel surface features. All of thesefeatures may be relatively complex and intricate for avoiding detectionand/or impeding counterfeiting by a third party. In addition, theadditive manufacturing process enables the manufacture of a singlecomponent having different materials such that different portions of thecomponent may exhibit different performance characteristics. Thesuccessive, additive nature of the manufacturing process enables theconstruction of these novel features. As a result, the componentsdescribed herein may exhibit improved performance and may be easilydistinguished from replicas or counterfeit components.

Referring now to FIGS. 1 through 3 an additively manufactured component100 according to an exemplary embodiment of the present subject matteris provided. More specifically, FIG. 1 provides a perspective view ofcomponent 100 and FIG. 2 provides a cross sectional view of component100, taken along Line 2-2 of FIG. 1. FIG. 3 provides a plot illustratingthe variation in surface height of component 100 about thecircumferential direction, as measured and described below.

Referring now specifically to FIG. 1, for the purpose of explainingaspects of the present subject matter, component 100 is a simple, solidcylinder. However, it should be appreciated that the additivemanufacturing methods described herein may be used to form any suitablecomponent for any suitable device, regardless of its material orcomplexity. As illustrated, component 100 generally defines a radialdirection R, a circumferential direction C, and a vertical direction V.

Also illustrated in FIG. 1 is an additive manufacturing platform 102 andan energy source 104, as may be used according to any of the additivemanufacturing methods described above. For example, component 100 may beconstructed by laying a powder bed onto platform 102 and selectivelyfusing the powder bed at desired locations using energy source 104 toform a layer of component 100. Platform 102 may be lowered along thevertical direction V after each layer is formed and the process may berepeated until component 100 is complete.

Referring to FIG. 2, a cross sectional view of component 100 taken alongLine 2-2 (or more specifically, a plane corresponding to this line) willbe described. It should be appreciated that FIG. 2 illustrates a topview of a single additively manufactured layer of component 100 having afinite thickness. As illustrated, component 100 includes a crosssectional layer 110. Cross sectional layer 110 may generally define aninterior body layer and a surface 112. As used herein, “interior bodylayer” may refer to any structure, body, surface, base layer, or otherportion of component 100 on which a surface may be formed. In thisregard, for example, component 100 includes surface 112 that is formedaround cross sectional layer 110, i.e., along a perimeter or peripheryof cross sectional layer 110 along the circumferential direction C. Asused herein, “surface” may refer to the periphery of one or more crosssectional layer 110 of component 100, e.g., formed on an otherwiseexposed interior body layer.

According to the illustrated embodiment, cross sectional layer 110 andsurface 112 may be formed at different energy levels and may havedifferent structural characteristics. As used herein, an “energy level”of an energy source is used generally to refer to the magnitude ofenergy the energy source delivers to a particular point or region ofcomponent 100. For example, if the energy source is a laser or anelectron beam, the energy level is generally a function of the powerlevel and the scan speed of the laser or electron beam. As used herein,“scan speed” is used generally to refer to the linear velocity of theenergy source along a surface of the additively manufactured component.Notably, the energy level of an energy source directed toward a powderbed may also be adjusted by increasing or decreasing the overlap betweenadjacent passes of the energy source over the powder bed.

Adjusting the energy level of energy source 104 can enable the formationof component 100 with different regions having different densities andstructural properties. For example, a higher energy level may beachieved by increasing the power level of energy source 104 (e.g., inWatts), decreasing its scan speed, or increasing the overlap betweenadjacent passes of energy source 104 to direct more energy onto a singlearea of the powder bed. By contrast, a lower energy level may beachieved by decreasing the power level of energy source 104, increasingits scan speed, or decreasing the overlap between adjacent passes ofenergy source 104 to direct less energy onto a single area of the powderbed.

According to the exemplary embodiment, component 100 is formed by movingenergy source 104 (or more specifically, a focal point of the energysource 104, as shown in FIG. 1) along a powder bed placed on platform102 to fuse together material to form component 100. According to theexemplary embodiment, a first energy level (e.g., a higher energy level)is used to form cross sectional layer 110 and a second energy level(e.g., a lower energy level) is used to form surface 112. It should beappreciated that this is only one exemplary construction of component100. According to alternative embodiments, components formed using themethods described herein may have any suitable size and number ofsections formed using any suitable energy source, at any suitable energylevel, and having any suitable scanning strategy.

According to exemplary embodiments of the present subject matter,component 100 may include a component identifier that may be used by thecomponent manufacturer, an end user, or another third party toauthenticate or positively identify component 100. The componentidentifier may be unique to a specific component, may be associated witha group of components manufactured at the same time, or may refer to atype of component in general. In this regard, for example, the componentidentifier may be integrated into or onto surface 112 of component 100such that the component identifier remains on component 100 throughoutthe lifetime of component 100. According to some exemplary embodiments,the component identifier may be any sequence of bump, divots, or othersurface aberrations that contain or define encoded information in amanner analogous to a printed serial number, a bar code, or a QR code,e.g., for uniquely identifying component 100. For example, the componentidentifier may include surface patterns, localized variations in surfacedensity, identifying material selectively placed within a primarysurface material, etc.

According to an alternative embodiment, the surface roughness at aparticular location on component 100 may serve as the componentidentifier, whether that surface roughness is inherent in themanufactured component or intentionally added to the completedcomponent. In this regard, for example, “inherent” surface roughness maybe used herein to refer to variations or irregularities in a surface ofa component that are not purposefully introduced, but are instead anartifact of the particular manufacturing process used to form thecomponent. Thus, the inherent stochastic nature of the surfacetopography in additively manufactured parts can serve as a partfingerprint.

According to the illustrated embodiment, component 100 includes at leastone surface irregularity 120 formed at least in part within surface 112of component 100. Surface irregularities 120 may be any identifiabledeviation from surface 112 of component 100 which may be used toidentify, authenticate, or distinguish component 100. For example,surface irregularities 120 may correspond to a printed serial number,bar code, a QR code, or any other sequence of bump, divots, or othersurface aberrations. According to exemplary embodiments, surfaceirregularities 120 may be used as the component identifier of component100, as described in the methods below. However, it should beappreciated that the component identifier may be any other suitableindicia for positively identifying component 100.

Surface irregularities 120 may be formed, for example, by manipulatingthe energy level of energy source 104. For example, as explained above,surface 112 is generally formed by moving energy source 104 at an energylevel. By altering the energy level at select locations along surface112, the amount of powder that is fused may be changed to alter thecharacteristics of surface 112. For example, surface irregularities 120may be bumps formed by increasing the energy level of energy source 104at select locations. In this regard, for example, the power of energysource 104 may be increased or the scan speed may be slowed to fuse morepowder. By contrast, surface irregularities 120 may be divots formed bydecreasing an energy level of energy source 104 at select locations. Inthis regard, for example, the power of energy source 104 may bedecreased or the scan speed may be increased to fuse less powder.

It should be appreciated that component 100 is described herein only forthe purpose of explaining aspects of the present subject matter. Forexample, component 100 will be used herein to describe exemplary methodsof manufacturing and authenticating additively manufactured components.It should be appreciated that the additive manufacturing techniquesdiscussed herein may be used to manufacture other components for use inany suitable device, for any suitable purpose, and in any suitableindustry. Furthermore, the authentication methods described herein maybe used to identify, authenticate, or otherwise distinguish suchcomponents. Thus, the exemplary components and methods described hereinare used only to illustrate exemplary aspects of the present subjectmatter and are not intended to limit the scope of the present disclosurein any manner.

Referring still to FIG. 2, an authentication system 130 will bedescribed according to exemplary embodiments of the present subjectmatter. Authentication system 130 may generally include a scanningdevice 132 for measuring surface height variations relative to a nominalsurface level. In this regard, for example, scanning device 132 may bean optical sensor (e.g., a laser), a tactile sensor (e.g., a measurementprobe, a coordinate measuring machine, a contact profilometer, etc.), orany other suitable device for sensing, measuring, or reading a surfaceof a component. Scanning device 132 may pass over surface 112 ofcomponent 100 in any suitable manner for mapping surface 112, orotherwise rendering some useful data regarding surface 112 of component100, e.g., the surface roughness, material variations, or the patternformed by one or more surface irregularities 120.

According to the illustrated embodiment, scanning device 132 includes acontroller 134 which is generally configured for receiving, analyzing,transmitting, or otherwise utilizing data acquired by scanning device132. Controller 134 can include various computing device(s) (e.g.,including processors, memory devices, etc.) for performing operationsand functions, as described herein. For reasons described in more detailbelow, scanning device 132, or more specifically, controller 134, mayfurther be in communication with a database or remote computing system136, e.g., via a network 140, and may be configured for transmitting orreceiving information related to component 100, e.g., such as itscomponent identifier.

Referring now to FIG. 3, the manner in which surface irregularities mayserve as a component identifier of component 100 will be described. Inthis regard, FIG. 3 provides a plot illustrating the variation insurface height of surface 112 of component 100 about the circumferentialdirection C is provided according to an exemplary embodiment. Morespecifically, FIG. 3 illustrates surface height variations relative tonominal as measured by scanning device 132 as it travels 360 degreesaround component 100 along the circumferential direction C. According tothis exemplary embodiment, surface irregularities 120 define a componentidentifier within a single circumferential band or layer of component100 along the vertical direction V. However, it should be appreciatedthat this component identifier may instead by located within multiplelayers of component 100 and may be localized to one or more regions onsurface 112 (see, e.g., FIG. 1), as explained below.

Notably, surface 112 will have a surface roughness after formation. Asused herein, “surface roughness” is used generally to refer to thetexture of surface 112 and is quantified as a deviation from a nominal,ideal surface as measured along a direction normal to surface 112, e.g.,the radial direction R. Surface roughness may be quantified generallyaccording to the micrometer (μm) Ra, where Ra is the arithmetic mean ofdeviation values as calculated to quantify the degree of roughness overa range of collected roughness data points. For example, surface 112 canhave a surface roughness of about 5 μm Ra to about 100 μm Ra. Morespecifically, referring to FIG. 3, the surface roughness of surface 112does not exceed a maximum surface roughness (as identified by referencenumeral 150) which is about fifty μm Ra relative to nominal (i.e., plusor minus fifty μm Ra). It should be appreciated, that as used herein,terms of approximation, such as “approximately,” “substantially,” or“about,” refer to being within a ten percent margin of error.

In order to differentiate between inherent surface roughness of surface112 of component 100, surface irregularities 120 may have a minimumsize. For example, according the exemplary embodiment, surfaceirregularities 120 are all greater than the maximum surface roughness(indicated by dotted lines 150 in FIG. 3). However, it may be desirableto make locating and identifying surface irregularities 120 moredifficult, e.g., to avoid detection using conventional low-tech scanningmeans. Therefore, according to an exemplary embodiment, surfaceirregularities 120 may be small enough to be undetectable to the humaneye or may require specialized scanning means to locate and read surfaceirregularities 120. For example, according to the illustratedembodiment, surface irregularities 120 have a size that is less than onemillimeter (as indicated by dotted lines 152 in FIG. 3).

According to an exemplary embodiment of the present subject matter, itmay be desirable to include one or more additional features on component100 which assist the manufacturer or an end user in locating anidentifying region 154 (see FIG. 1) which may contain surfaceirregularities 120. For example, as explained above, surfaceirregularities 120 may not be visible to the human eye. Thus, to avoidthe need to scan the entire surface 112 to locate and read surfaceirregularities 120, one or more datum features may be used as areference from which an authorized end user may find identifying region154.

More specifically, referring again to FIG. 1, component 100 furtherincludes a datum feature 170 that is visible to the human eye orotherwise easily detectable. For example, according to the exemplaryembodiment, datum feature 170 has a size that is greater than about onemillimeter. Moreover, datum feature 170 may indicate both a position andan orientation of component 100. According to the illustratedembodiment, datum feature 170 is formed within surface 112 of component100. However, it should be appreciated that according to alternativeembodiments, datum feature 170 may be formed within the interior ofcomponent 100 or cross sectional layer 110 and/or within both theinterior of cross sectional layer 110 and surface 112 of component.

Datum feature 170 is located at a predetermined location relative toidentifying region 154—and thus surface irregularities 120. In thismanner, an authorized third party who knows the relative positioning ofdatum feature 170 and identifying region 154 may easily locate datumfeature 170 and use it as a reference for locating and scanningidentifying region 154 to read surface irregularities 120.

Now that the construction and configuration of component 100 accordingto an exemplary embodiment of the present subject matter has beenpresented, an exemplary method 200 for forming a component according toan exemplary embodiment of the present subject matter is provided.Method 200 can be used by a manufacturer to form component 100, or anyother suitable part or component. It should be appreciated that theexemplary method 200 is discussed herein only to describe exemplaryaspects of the present subject matter, and is not intended to belimiting.

Referring now to FIG. 4, method 200 includes, at step 210, additivelymanufacturing a component comprising a surface. This may include, forexample, additively manufacturing a base and surface, such as describedabove with respect to component 100. Notably, according to alternativeembodiments, step 210 may be omitted and steps 220 through 280(described below) may be performed on any previously manufacturedcomponent for cataloguing a reference identifier for use inauthentication.

Method 200 further includes, at step 220, specifying an identifyingregion on the surface of the component. As explained above, theidentifying region may be any area on the component that contains acomponent identifier of the component. For example, identifying region154 of component 100 contains a sequence of surface irregularities 120that collectively define a component identifier. However, it should beappreciated that according to alternative embodiments, the componentidentifier could instead be a printed number, bar code, QR code, etc.

According to exemplary embodiments, the surface further includes a datumfeature which may be used to determine the specific position andorientation of the component. The identifying region may be positionedat a predetermined location relative to the datum feature to assist inlocating the identifying region, e.g., when the component identifier isnot readily detectable.

After the identifying region is located, step 230 includes obtainingdata indicative of a component identifier of the component byinterrogating the identifying region of the component using a scanner.For example, this step may include scanning identifying region 154 usingscanning device 132. Step 240 includes storing the component identifierin a database as a reference identifier. In this manner, the referenceidentifier stored in the database is associated with an authenticcomponent. According to an exemplary embodiment, the manufacturer of thecomponent enters the reference identifiers and controls the database ofauthentic components. According to the exemplary embodiments of FIGS. 1through 3, the database may be stored in controller 134, remotecomputing system 136, or both.

Thus, steps 210 through 240 may be generally used for querying orreading a component for identification data and storing that data forsubsequent component validation, as described below with respect tosteps 250 through 280. More specifically, a component is validated if itcontains a component identifier that matches a reference identifier inthe database. As used herein, the component identifier “matches” thereference identifier if a positive identification or verification may bemade between the two parts. In this regard, a 100% identical match isnot required, as the component identifier may have degraded or changedduring the life of the component, there may be variations in scanneraccuracy or calibration, etc. However, there should still be asufficient resemblance between the component identifier and thereference identifier that a party may, with a reasonable degree ofaccuracy, determine that the component bearing the component identifieris indeed the same component from which the reference identifier wasobtained and catalogued in the database.

Method 200 further includes, at step 250, receiving a validationidentifier. As used in method 200, the validation identifier resultsfrom a scan of the identifying region of a component by a third party,such as an end user. Thus, if the component is authentic, the validationidentifier is the component identifier which should match a referenceidentifier stored in the manufacturer's database. At step 260, thevalidation identifier is compared to the reference identifier (stored inthe database), and step 270 includes determining that the component isauthentic if the validation identifier matches the reference identifier.Step 280 includes providing an indication that the component isauthentic in response to determining that the component is authentic.

Referring now to FIG. 5, an exemplary method 300 for authenticating acomponent according to an exemplary embodiment of the present subjectmatter is provided. Method 300 can be used by a customer or end user ofa component, e.g., such as the end user of component 100, for validatingthat the component is authentic and is not a counterfeit component. Itshould be appreciated that the exemplary method 300 is discussed hereinonly to describe exemplary aspects of the present subject matter, and isnot intended to be limiting.

Method 300 includes, at step 310, locating a datum feature on acomponent, the datum feature being positioned at a predeterminedlocation relative to an identifying region. Step 320 includesdetermining the location of the identifying region based on the locationof the datum feature, the identifying region containing a componentidentifier of the component. More specifically, using component 100 asan example, step 310 includes determining the position and orientationof component 100 from datum feature 170 and, based on knowledge of therelative positioning of datum feature 170 and identifying region 154,locating identifying region 154.

After the identifying region is located, step 330 includes obtaining thecomponent identifier by interrogating the identifying region of thecomponent using a scanner. Continuing the example from above, surfaceirregularities 120 may be measured using scanning device 132. Step 340includes obtaining a reference identifier from a database. As explainedin the description of method 200, the reference identifier may be thecomponent identifier as measured and catalogued in the database by themanufacturer of the component. According to an exemplary embodiment, thereference identifier may be obtained from a database stored locally,e.g., on controller 134. Alternatively, the database may be remotelystored and may be accessed, for example, through remote computing system136 via network 140.

Step 350 includes comparing the component identifier to the referenceidentifier and step 360 includes determining that the component isauthentic if the component identifier matches the reference identifier.In this regard, for example, controller 134 may receive the referenceidentifier from a database and may be programmed to compare thereference identifier and the component identifier to positivelydetermine whether the component is authentic.

As discussed herein, one or more portion(s) of methods 200 and 300 canbe implemented by controller 134, by remote computing system 136, orboth. Thus, for example, it should be appreciated that according tocertain embodiments, the component authentication may be performed by aparty other than the end user, e.g., the manufacturer. In such anembodiment, the end user may transmit the component identifier asmeasured from the component to the manufacturer. The manufacturer maythen perform steps 340 through 360—i.e., obtain the referenceidentifier, compare the reference identifier and the componentidentifier, and make a determination regarding authenticity. If thecomponent is determined to be authentic, the manufacturer may thentransmit a signal to the end user indicating that the component isauthentic. By contrast, if the component identifier does not match areference identifier from the database, the manufacturer may provide anindication to the end user that the component might be a counterfeit.

FIGS. 4 and 5 depict steps performed in a particular order for purposesof illustration and discussion. Those of ordinary skill in the art,using the disclosures provided herein, will understand that the steps ofany of the methods discussed herein can be adapted, rearranged,expanded, omitted, or modified in various ways without deviating fromthe scope of the present disclosure. Moreover, although aspects ofmethods 200, 300 are explained using component 100 as an example, itshould be appreciated that these methods may be applied to authenticateany suitable component.

An additively manufactured component and a method for manufacturing andauthenticating that component are described above. Using the additivemanufacturing methods described herein, the component may includeidentifying features that are smaller, more complex, and more intricatethan possible using prior manufacturing methods. In addition, thesefeatures may be difficult or impossible to detect, very difficult toreverse engineer, and nearly impossible reproduce, e.g., for the purposeof producing counterfeit products. For example, the surfaceirregularities may be designed to appear random and non-obvious. Thesefeatures may further be formed such that they are not visible to thehuman eye and may be read using laser scanning methods directed to aspecific identifying region of the component that is unknown to thirdparties. These features may be introduced during the design of thecomponent, such that they may be easily integrated into componentsduring the build process at little or no additional cost. The featuresmay also serve as a robust identifier capable of withstanding hightemperatures without degradation throughout the life of the component,with little or no impact on the quality of the component. Furthermore,these features may be authenticated through comparison with previouslycatalogued reference identifiers.

FIG. 6 depicts authentication system 130 according to exampleembodiments of the present disclosure. As shown above in FIG. 2,authentication system 130 can include one or more controllers 134 and/orremote computing systems 136, which can be configured to communicate viaone or more network(s) (e.g., network(s) 140). According to theillustrated embodiment, remote computing system 136 is remote fromcontroller 134. However, it should be appreciated that according toalternative embodiments, remote computing system 136 can be includedwith or otherwise embodied by controller 134.

Controller 134 and remote computing system 136 can include one or morecomputing device(s) 180. Although similar reference numerals will beused herein for describing the computing device(s) 180 associated withcontroller 134 and remote computing system 136, respectively, it shouldbe appreciated that each of controller 134 and remote computing system136 may have a dedicated computing device 180 not shared with the other.According to still another embodiment, only a single computing device180 may be used to implement methods 200 and 300 as described above, andthat computing device 180 may be included as part of controller 134 orremote computing system 136.

Computing device(s) 180 can include one or more processor(s) 180A andone or more memory device(s) 180B. The one or more processor(s) 180A caninclude any suitable processing device, such as a microprocessor,microcontroller, integrated circuit, an application specific integratedcircuit (ASIC), a digital signal processor (DSP), a field-programmablegate array (FPGA), logic device, one or more central processing units(CPUs), graphics processing units (GPUs) (e.g., dedicated to efficientlyrendering images), processing units performing other specializedcalculations, etc. The memory device(s) 180B can include one or morenon-transitory computer-readable storage medium(s), such as RAM, ROM,EEPROM, EPROM, flash memory devices, magnetic disks, etc., and/orcombinations thereof.

The memory device(s) 180B can include one or more computer-readablemedia and can store information accessible by the one or moreprocessor(s) 180A, including instructions 180C that can be executed bythe one or more processor(s) 180A. For instance, the memory device(s)180B can store instructions 180C for running one or more softwareapplications, displaying a user interface, receiving user input,processing user input, etc. In some implementations, the instructions180C can be executed by the one or more processor(s) 180A to cause theone or more processor(s) 180A to perform operations, as described herein(e.g., one or more portions of methods 200, 300). More specifically, forexample, the instructions 180C may be executed to perform a comparisonbetween a reference identifier and a component identifier, to perform anauthentication analysis, to transmit an indication of authenticity, etc.The instructions 180C can be software written in any suitableprogramming language or can be implemented in hardware. Additionally,and/or alternatively, the instructions 180C can be executed in logicallyand/or virtually separate threads on processor(s) 180A.

The one or more memory device(s) 180B can also store data 180D that canbe retrieved, manipulated, created, or stored by the one or moreprocessor(s) 180A. The data 180D can include, for instance, dataindicative of reference identifiers associated with authentic additivelymanufactured components. The data 180D can be stored in one or moredatabase(s). The one or more database(s) can be connected to controller134 and/or remote computing system 136 by a high bandwidth LAN or WAN,or can also be connected to controller through network(s) 140. The oneor more database(s) can be split up so that they are located in multiplelocales. In some implementations, the data 180D can be received fromanother device.

The computing device(s) 180 can also include a communication interface180E used to communicate with one or more other component(s) ofauthentication system 130 (e.g., controller 134 or remote computingsystem 136) over the network(s) 140. The communication interface 180Ecan include any suitable components for interfacing with one or morenetwork(s), including for example, transmitters, receivers, ports,controllers, antennas, or other suitable components.

The network(s) 140 can be any type of communications network, such as alocal area network (e.g. intranet), wide area network (e.g. Internet),cellular network, or some combination thereof and can include any numberof wired and/or wireless links. The network(s) 140 can also include adirect connection between one or more component(s) of authenticationsystem 130. In general, communication over the network(s) 140 can becarried via any type of wired and/or wireless connection, using a widevariety of communication protocols (e.g., TCP/IP, HTTP, SMTP, FTP),encodings or formats (e.g., HTML, XML), and/or protection schemes (e.g.,VPN, secure HTTP, SSL).

The technology discussed herein makes reference to servers, databases,software applications, and other computer-based systems, as well asactions taken and information sent to and from such systems. It shouldbe appreciated that the inherent flexibility of computer-based systemsallows for a great variety of possible configurations, combinations, anddivisions of tasks and functionality between and among components. Forinstance, computer processes discussed herein can be implemented using asingle computing device or multiple computing devices (e.g., servers)working in combination. Databases and applications can be implemented ona single system or distributed across multiple systems. Distributedcomponents can operate sequentially or in parallel. Furthermore,computing tasks discussed herein as being performed at the computingsystem (e.g., a server system) can instead be performed at a usercomputing device. Likewise, computing tasks discussed herein as beingperformed at the user computing device can instead be performed at thecomputing system.

This written description uses examples to disclose the invention,including the best mode, and also to enable any person skilled in theart to practice the invention, including making and using any devices orsystems and performing any incorporated methods. The patentable scope ofthe invention is defined by the claims, and may include other examplesthat occur to those skilled in the art. Such other examples are intendedto be within the scope of the claims if they include structural elementsthat do not differ from the literal language of the claims, or if theyinclude equivalent structural elements with insubstantial differencesfrom the literal languages of the claims.

What is claimed is:
 1. A method of authenticating an additivelymanufactured component, the method comprising: obtaining, by one or moreprocessors, data indicative of an identifying region on the component,the identifying region containing a component identifier of thecomponent; obtaining, by one or more processors, data indicative of thecomponent identifier by interrogating the identifying region of thecomponent with a scanner; and determining, by one or more processors,that the component is authentic based on the data acquired by thescanner.
 2. The method of claim 1, wherein obtaining data indicative ofthe identifying region comprises: locating a datum feature on thecomponent, the datum feature being positioned at a predeterminedlocation relative to the identifying region; and determining, by one ormore processors, the location of the identifying region based on thelocation of the datum feature.
 3. The method of claim 1, whereindetermining that the component is authentic comprises: obtaining, by oneor more processors, a reference identifier from a database; comparing,by one or more processors, the component identifier to the referenceidentifier; and determining, by one or more processors, that thecomponent is authentic if the component identifier matches the referenceidentifier.
 4. The method of claim 1, wherein the scanner is a laser andobtaining data indicative of the component identifier comprises usingthe laser to optically scan the identifying region of the component. 5.The method of claim 1, wherein the scanner is a tactile measurementmachine and obtaining data indicative of the component identifiercomprises generating a topographical map of the identifying region usingthe tactile measuring machine.
 6. The method of claim 1, wherein thecomponent identifier is an inherent surface roughness of the componentafter manufacture.
 7. The method of claim 1, wherein the componentidentifier is additively manufactured onto the component.
 8. A systemfor authenticating an additively manufactured component, the systemcomprising: one or more processors; and one or more memory devices, theone or more memory devices storing computer-readable instructions thatwhen executed by the one or more processors cause the one or moreprocessors to perform operations, the operations comprising: obtainingdata indicative of an identifying region on the component, theidentifying region containing a component identifier of the component;determining the component identifier by interrogating the identifyingregion of the component using a scanner; obtaining a referenceidentifier from a database; and determining that the component isauthentic if the component identifier matches the reference identifier.9. The system of claim 8, further comprising: locating a datum featureon the component, the datum feature being positioned at a predeterminedlocation relative to the identifying region; and determining thelocation of the identifying region based on the location of the datumfeature.
 10. The system of claim 8, wherein the scanner is a laser anddetermining the component identifier comprises using the laser tooptically scan the identifying region of the component.
 11. The systemof claim 8, wherein the scanner is a tactile measuring machine anddetermining the component identifier comprises generating atopographical map of the identifying region using the tactile measuringmachine.
 12. The system of claim 8, wherein the component identifier isan inherent surface roughness of the component after manufacture. 13.The system of claim 8, wherein the component identifier is additivelymanufactured onto the component.
 14. The system of claim 9, wherein thecomponent identifier has a size that is smaller than about 50micrometers and the datum feature has a size that is greater than aboutone millimeter.
 15. A method of additively manufacturing a component,the method comprising: additively manufacturing the component comprisinga surface; specifying an identifying region on the surface of thecomponent; obtaining data indicative of a component identifier of thecomponent by interrogating the identifying region of the component usinga scanner; and storing the component identifier in a database as areference identifier.
 16. The method of claim 15, further comprising:receiving a validation identifier; comparing the validation identifierto the reference identifier; and determining that the component isauthentic if the validation identifier matches the reference identifier.17. The method of claim 16, further comprising: providing an indicationthat the component is authentic in response to determining that thecomponent is authentic.
 18. The method of claim 15, wherein theidentifying region is positioned at a predetermined location relative toa datum feature.
 19. The method of claim 15, wherein the scanner is alaser and obtaining data indicative of the component identifiercomprises using the laser to optically scan the identifying region ofthe component.
 20. The method of claim 15, wherein the componentidentifier is an inherent surface roughness of the component aftermanufacture.